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BGA Assembly Capabilities

What is BGA?

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.[citation needed]

Soldering of BGA devices requires precise control and is usually done by automated processes.


Ball Grid Array (BGA) style circuit boards, which used small circular balls of solder to allow the flow of electricity between parts of the circuit. This brought with it a number of advantages to PCB assembly: 

.Higher-density circuits: As through-hole circuits were more densely-populated, soldering them accurately without crossover or short-circuits became nearly impossible.

.Heat conduction: BGA circuits allow heat to pass much more easily from the integrated circuit outwards, reducing overheating problems.

.Lower inductance: Because each solder ball in a BGA circuit is generally only a handful of millimeters large, problems from interference within the circuit are greatly minimized.

PCBWay BGA Assembly Capabilities:

.Four automated placement systems available with Vision Systems capable of inspecting solder ball coverage. 

.One automated system available with a 3-D laser capable of inspecting solder ball height Automatic placement of CBGA, PBGA, and MBGA 

.Verification of BGA’s using Phoenix real-time x-ray system. 


The usually BGA technology of PCBWay are minimum size 0.3mm, the minimum distance to circuit line is 0.2mm,the minimum distance between two BGA is 0.2mm. If you need higher requirement, please make a note


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